Integrity of Power Electronic Components on a Rotating PCB
2025 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2025, Nuremberg, Almanya, 6 - 08 Mayıs 2025, ss.1072-1078, (Tam Metin Bildiri)
- Yayın Türü: Bildiri / Tam Metin Bildiri
- Doi Numarası: 10.30420/566541139
- Basıldığı Şehir: Nuremberg
- Basıldığı Ülke: Almanya
- Sayfa Sayıları: ss.1072-1078
- İstanbul Üniversitesi-Cerrahpaşa Adresli: Hayır
Özet
This paper presents an initial study on the physical integrity of small power electronic components mounted on a rotating Printed Circuit Board (PCB) using solder-pin pairs. A practical approach, based on measured failure stress of the solder-pin pairs, is used to predict the rotational speeds - and corresponding inertial forces - at which components may lose their connection to the PCB. High-speed rotational tests of the PCB are conducted to validate the approach. Results indicate that the method provides conservative predictions for the failure of inertial loads of the components, ensuring a safety factor in practical applications.